Abstract: Against the backdrop of rapid expansion of domestic integrated circuit (IC) fabrication, massive volumes of hazardous wastes are continuously produced throughout chip manufacturing workflows, encompassing fluorine-laden residues, heavy metalbearingliquid-solid mixed wastes, chemical mechanical polishing (CMP) slurries, spent mineral acids/alkalis, and waste organic solvents. Traditional end-of-pipe disposal strategies are plagued by exorbitant operational expenditures, irreversible dissipation of valuable mineral resources, and substantial risks of secondary environmental contamination, rendering them incompatible with the industry’s pursuit of low-carbon, sustainable manufacturing paradigms. This work systematically characterizes the generation profilesand in herent recyclable potentials of representative IC waste streams, comprehensively evaluates the engineering compatibility and industrial deployment status of state-of-the-art resource recovery techniques, and further identifies critical technical and institutional constraints, such as the intractable separation of multicomponent impurity matrices, substandard purity of recycled intermediates, excessive energy footprints, and the absence of unified industrial specifications. Our analysis demonstrates a distinct tiered maturity gradient across prevailing recycling technologies: routine recovery workflows have attained full commercialization, whereas advanced routes for deep fluorine purification, rare earth extraction, and refinement of spent organic solvents are confined to laboratory bench and pilot demonstration stages. Noticeable research deficits persist concerning synergistic valorization of mixed waste fractions and cross-sector high-value reuse of recycled materials. To address these bottlenecks, forward-looking research avenues are delineated across four core dimensions: developing high-precision selective separation methodologies, establishing integrated coupled recovery workflows, formulating standardized industrial regulatory frameworks, and deploying intelligent full-process monitoring and control systems. This review delivers theoretical and engineering insights to advance waste minimization and closed-loop high-value resource cycling within the IC manufacturing sector.