Chinese Journal of Nature ›› 2026, Vol. 48 ›› Issue (1): 41-50.doi: 10.3969/j.issn.0253-9608.2026.01.008

• Review Article • Previous Articles     Next Articles

Applications and challenges of metal-polyphenols in diabetic wound repair

LIANG Xiaodan, DU Jiyuan, XIAN Caihong①②, WU Jun①③   

  1. ① Bioscience and Biomedical Engineering Thrust, The Hong Kong University of Science and Technology (Guangzhou), Guangzhou 511400, China; ② Department of Orthopedics, The Seventh Affiliated Hospital, Sun Yat-sen University, Shenzhen 518107, Guangdong Province, China; ③ Division of Life Science, The Hong Kong University of Science and Technology, Hong Kong 999077, China
  • Received:2025-12-06 Online:2026-02-25 Published:2026-02-06

Abstract: Diabetes mellitus is a globally prevalent metabolic disorder frequently associated with microvascular and macrovascular complications. Among these, diabetic wounds represent one of the most severe sequelae, significantly compromising patient quality of life. Current clinical drugs are often limited by high costs, restricted accessibility, and the potential for adverse side effects, necessitating the urgent development of novel therapeutic strategies. In recent years, metal-phenolic materials have garnered increasing attentions due to their superior biocompatibility, antioxidant activity, and anti-inflammatory properties. Here, we systematically review the progress of metal-phenolic networks (MPNs) in diabetic wound repair. We first review the characteristics of the aberrant diabetic wound microenvironment and the mechanisms underlying impaired healing. Subsequently, we elucidate the assembly strategies of various metal-phenolic systems and their specific applications in modulating this microenvironment, including their anti-inflammatory, antioxidant, and pro-angiogenic properties. Finally, we critically evaluate the current technical challenges in the field and provide an outlook on future engineering designs and clinical translation pathways, aimed at offering a theoretical framework for the development of next-generation materials for diabetic wound repair.